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2025_Stegmann_Enhancing_Silver_Sintering

dc.contributor.author Stegmann, Tamira
dc.contributor.author Bruder, Enrico
dc.contributor.author Gunst, Stefan
dc.contributor.author Schwöbel, André
dc.contributor.author Durst, Karsten
dc.date.accessioned 2025-04-24T15:36:50Z
dc.date.available 2025-04-24T15:36:50Z
dc.date.created 2025
dc.date.issued 2025-04-24
dc.description Updated research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength de_DE
dc.description.version Updated version after peer review de_DE
dc.identifier.uri https://tudatalib.ulb.tu-darmstadt.de/handle/tudatalib/4566
dc.identifier.uri https://doi.org/10.48328/tudatalib-1749
dc.language.iso en de_DE
dc.rights.licenseCC-BY-4.0 (https://creativecommons.org/licenses/by/4.0)
dc.subject.classification 4.31-02
dc.subject.classification 4.42-03
dc.subject.ddc 621.3
dc.subject.ddc 620
dc.title 2025_Stegmann_Enhancing_Silver_Sintering de_DE
dc.type Dataset de_DE
dcterms.accessRights openAccess
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tuda.unit TUDa

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