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2025_Stegmann_Enhancing_Silver_Sintering

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Enhancing Silver Sintering (updated).zip (580.57 MB)

Date

2025-04-24

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Authors

Stegmann, Tamira
Bruder, Enrico
Gunst, Stefan
Schwöbel, André
Durst, Karsten

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Abstract

Description

Updated research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength

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https://tudatalib.ulb.tu-darmstadt.de/handle/tudatalib/4566
 https://doi.org/10.48328/tudatalib-1749

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DFG Classification

4.31-02 Materialien und Werkstoffe der Sinterprozesse und der generativen Fertigungsverfahren
4.42-03 Elektrische Energiesysteme, Power Management, Leistungselektronik, elektrische Maschinen und Antriebe

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CC BY 4.0 - Attribution 4.0 International
Except where otherwise noted, this license is described as CC BY 4.0 - Attribution 4.0 International