Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability

dc.contributor.author Stegmann, Tamira
dc.contributor.author Durst, Karsten
dc.contributor.author Bruder, Enrico
dc.contributor.author Schöbel, André
dc.date.accessioned 2025-10-06T09:22:39Z
dc.date.created 2025-10-06
dc.date.issued 2025-10-06
dc.description Publication data for the article "Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability" by Stegmann et al. published in Journal of Materials Science: Materials in Electronics (JMSE)
dc.identifier.uri https://tudatalib.ulb.tu-darmstadt.de/handle/tudatalib/4834
dc.identifier.uri https://doi.org/10.48328/tudatalib-1966
dc.language.iso en
dc.rights.licenseCC-BY-4.0 (https://creativecommons.org/licenses/by/4.0)
dc.subject.classification 4.31-04
dc.subject.classification 4.42-03
dc.subject.ddc 620
dc.subject.ddc 621.3
dc.title Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability
dc.type Image
dc.type Dataset
dcterms.accessRights openAccess
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