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Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability

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Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability.zip (44.98 MB)

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2025-10-06

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Stegmann, Tamira
Durst, Karsten
Bruder, Enrico
Schöbel, André

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Publication data for the article "Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability" by Stegmann et al. published in Journal of Materials Science: Materials in Electronics (JMSE)

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https://tudatalib.ulb.tu-darmstadt.de/handle/tudatalib/4834
 https://doi.org/10.48328/tudatalib-1966

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4.31-04 Mechanische Eigenschaften von metallischen Werkstoffen und ihre mikrostrukturellen Ursachen
4.42-03 Elektrische Energiesysteme, Power Management, Leistungselektronik, elektrische Maschinen und Antriebe

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CC BY 4.0 - Attribution 4.0 International
Except where otherwise noted, this license is described as CC BY 4.0 - Attribution 4.0 International