Wir ändern die Abläufe zur DOI Registrierung in einem Pilotprojekt zur Kuratierung für FAIRere Daten, siehe Nachrichtenmeldung
We are chaging DOI registration workflows in a curation pilot for FAIRer data, please see news item
 
Open Access

Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability

Abstract

Description

Publication data for the article "Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability" by Stegmann et al. published in Journal of Materials Science: Materials in Electronics (JMSE)

Keywords

Citation

Endorsement

Project(s)

Faculty

Collections

License

Except where otherwise noted, this license is described as CC BY 4.0 - Attribution 4.0 International