2025_Stegmann_Enhancing_Silver_Sintering
| dc.contributor.author | Stegmann, Tamira | |
| dc.contributor.author | Durst, Karsten | |
| dc.contributor.author | Bruder, Enrico | |
| dc.contributor.author | Gunst, Stefan | |
| dc.contributor.author | Schwöbel, André | |
| dc.date.accessioned | 2025-02-10T10:57:02Z | |
| dc.date.available | 2025-02-10T10:57:02Z | |
| dc.date.created | 2025 | |
| dc.date.issued | 2025-02-10 | |
| dc.description | Research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength | de_DE |
| dc.identifier.uri | https://tudatalib.ulb.tu-darmstadt.de/handle/tudatalib/4462 | |
| dc.identifier.uri | https://doi.org/10.48328/tudatalib-1666 | |
| dc.language.iso | en | de_DE |
| dc.rights.license | CC-BY-4.0 (https://creativecommons.org/licenses/by/4.0) | |
| dc.subject | power electronics | de_DE |
| dc.subject | silver sintering | de_DE |
| dc.subject | microstructure | de_DE |
| dc.subject | grain orientation | de_DE |
| dc.subject.classification | 4.31-02 | |
| dc.subject.classification | 4.42-03 | |
| dc.subject.ddc | 620 | |
| dc.subject.ddc | 621.3 | |
| dc.title | 2025_Stegmann_Enhancing_Silver_Sintering | de_DE |
| dc.type | Dataset | de_DE |
| dcterms.accessRights | openAccess | |
| person.identifier.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| person.identifier.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| person.identifier.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| person.identifier.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| person.identifier.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| tuda.unit | TUDa |
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| Name | Description | Size | Format | |
|---|---|---|---|---|
| Enhancing Silver Sintering.zip | Figures and Data | 581.06 MB | ZIP-Archivdateien |
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