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Open Access

2025_Stegmann_Enhancing_Silver_Sintering

Thumbnail Image

Files

Enhancing Silver Sintering.zip (Figures and Data) (581.06 MB)

Date

2025-02-10

Type

Dataset

Authors

Stegmann, Tamira
Durst, Karsten
Bruder, Enrico
Gunst, Stefan
Schwöbel, André

Journal Title

Journal ISSN

Volume Title

Publisher

Abstract

Description

Research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength

Keywords

power electronics, silver sintering, microstructure, grain orientation

Citation

Identifier

https://tudatalib.ulb.tu-darmstadt.de/handle/tudatalib/4462
 https://doi.org/10.48328/tudatalib-1666

Endorsement

DFG Classification

4.31-02 Materialien und Werkstoffe der Sinterprozesse und der generativen Fertigungsverfahren
4.42-03 Elektrische Energiesysteme, Power Management, Leistungselektronik, elektrische Maschinen und Antriebe

Project(s)

Faculty

Collections

Publication-data

License

CC BY 4.0 - Attribution 4.0 International
Except where otherwise noted, this license is described as CC BY 4.0 - Attribution 4.0 International

Version History

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VersionDateSummary
1*
 2025-02-10 11:57:02
* Selected version